Uniform copper deposition, reliable via filling ability, elimination of surface roughness, and minimum additive consumption make DENORA DT® anodes the solution for today’s challenge in the electronics industry.
DENORA DT® anodes are offered in standard and custom designs to ensure optimum performance:
- Uniform plating distribution and excellent throwing power
- Extremely low additive consumption without membrane
- Improved plating bath life with stable performance
- Less bath maintenance by reducing toc
- Long service life and elimination of anode maintenance
- Increased equipment productivity by high current density operation